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Epoxy Resin

    • Product Name: Epoxy Resin
    • Factroy Site: No. 100, Qinhuai Road, Jiangning District, Nanjing, Jiangsu, China
    • Price Inquiry: sales3@ascent-chem.com
    • Manufacturer: Ascent Petrochem Holdings Co., Limited
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    Specifications
    HS Code 893307
    State Liquid at room temperature
    Color Pale amber to clear
    Viscosity 900–1800 mPa·s at 25°C
    Density 1.10–1.20 g/cm³ at 25°C
    Mixing Ratio 2:1 resin to hardener by volume
    Pot Life 30–60 minutes at 25°C
    Curing Time 24 hours at 25°C for full cure
    Glass Transition Temperature 50–120°C depending on formulation
    Tensile Strength 60–90 MPa
    Compressive Strength 90–130 MPa
    Flexural Strength 80–140 MPa
    Shrinkage 1–2% during curing
    Hardness Shore D 75–90
    Thermal Conductivity 0.2–0.4 W/(m·K)
    Electrical Insulation High dielectric strength, >15 kV/mm
    Adhesion Excellent to metals, glass, ceramics, and most plastics
    Chemical Resistance Resistant to water, acids, alkalis, and many solvents
    Shelf Life 12–24 months in sealed containers at 25°C

    As an accredited Epoxy Resin factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Epoxy Resin packaged in sealed 1 kg containers with sturdy, corrosion-resistant lining to prevent leakage and ensure safe transport.
    Container Loading (20′ FCL) Epoxy Resin packed in sealed drums/IBCs, loaded into 20′ FCL, secured upright, with proper ventilation and segregation from incompatible materials.
    Shipping Epoxy resin must be shipped in sealed, corrosion-resistant containers, clearly labeled and protected from extreme temperatures. Depending on formulation, it may require hazardous material classification and documentation. Ensure proper ventilation, spill containment, and compliance with IATA/IMDG/ADR regulations to prevent leaks, contamination, or polymerization hazards during transit.
    Storage Store epoxy resin in a cool, dry, well-ventilated area away from heat, sparks, and direct sunlight. Keep containers tightly sealed to prevent moisture absorption and contamination. Avoid extreme temperatures; ideal range is typically 15–25°C. Check expiration dates and manufacturer instructions, and ensure separation from hardeners and incompatible materials.
    Shelf Life Epoxy resin typically has a shelf life of one to two years when stored unopened in a cool, dry place away from sunlight.
    Application of Epoxy Resin

    Where Overcoat Windows Dictate Offshore Coating Schedules

    Offshore coating operators record overcoat failure less as a result of resin quality than as a consequence of exceeding the maximum recoat interval defined by amine-blush formation. High-solids offshore protective systems based on liquid bisphenol A epoxy resin with an epoxide equivalent weight of 188–192 g/eq are formulated with polyamide or phenalkamine hardeners at 55–75 phr according to the amine hydrogen equivalent weight of the selected hardener. The plural-component material is sprayed through a 45:1 airless pump at 210 bar after an induction period of 10–20 min at 23 °C. Substrate preparation follows ISO 8501-1:2007 to Sa 2½, with dust class assessed under ISO 8502-3:2017. Stripe coating of welds, edges, and penetrations is applied before full spray passes to avoid premature edge loss in service. Dry film thickness in ballast tanks is maintained at 300–500 μm, and the first full coat is applied only when the steel surface temperature is at least 3 °C above dew point and relative humidity remains below 85 %. When humidity exceeds 85 %, amine blush formation accelerates, and the recoat window shrinks from 48 h to less than 24 h in poorly ventilated tanks. Adhesion testing under ASTM D4541-17 on blasted steel typically requires pull-off values not less than 5 MPa for ballast tank service. Corrosion resistance is qualified through ASTM D5894-21 cyclic salt spray/UV testing for 3000 h and prequalification under NORSOK M-501:2022 where specified by offshore operator specifications. End products include ship ballast tank linings, offshore wind transition piece coatings, jetty riser coatings, and cargo tank linings for chemical carriers. Operational boundaries are specific: polyamide-cured systems should not be overcoated after the hard film develops amine blush, and phenalkamine systems with low-temperature cure below 5 °C require verification of through-cure by differential scanning calorimetry because surface hardness alone is insufficient to confirm crosslink completion.

    For spar cap laminates in land-based and offshore rotor blades, liquid epoxy resin selection is driven less by ambient shelf life than by the inflection point at which exothermic enthalpy from the curing reaction approaches the heat-transfer capacity of the vacuum infusion stack. Infusion-grade liquid epoxy resin is mixed with an amine hardener at a 100:30 mass ratio, giving an initial viscosity of 250–350 mPa·s at 25 °C measured under ISO 3219:2021. Pot life at 23 °C is typically 90 min, which is the controlling parameter when multiple infusion lines are filled from a single static mixer. The vacuum bag is evacuated to −0.85 to −0.95 bar, and the resin front is maintained with a pressure differential of 30–50 mbar between the resin inlet and the vacuum outlet to reduce dry-spot formation in thick spar cap sections. In laminates thicker than 60 mm, the exotherm peak can exceed 140 °C during the final cure ramp, causing microcracking at resin-rich interlayers if the mold heat-transfer rate is below the heat generation rate. A staged cure of 50 °C for 2 h followed by 80 °C for 8 h, with a ramp rate not exceeding 0.3 °C/min, is used to limit exotherm severity. Glass transition temperature after this schedule is 80–90 °C by ISO 11357-2:2020. Formulation adjustments include internal mold release at 0.5–1.0 phr and wetting agent at 0.3–0.5 phr to maintain compatibility with glass and pultruded carbon fiber reinforcement. Compliance with IEC 61400-5:2020 and DNVGL-ST-0376 requires laminate test programs covering tensile properties under ISO 527-4:2021 and full-scale blade fatigue testing. Downstream production equipment includes vacuum-assisted resin transfer molding lines with biaxial glass or carbon spar cap stacks, root preforms, and shear web molds. Terminal products are spar caps, aerodynamic shells, shear webs, and blade root preforms for onshore and offshore wind turbines. Fiber wetting limits are process-critical: when resin viscosity exceeds 350 mPa·s at the injection temperature, pultruded carbon fiber stacks with low permeability show incomplete wet-out at the root transition, and the resulting dry glass transition drops below the design minimum.

    What Happens to Silica Filler Packing When Encapsulant Viscosity Must Stay Below 12 Pa·s?

    In power module encapsulation, the dominant processing constraint is not initial mixed viscosity but the upper limit of silica filler packing before capillary underfill flow stops inside a 0.05 mm chip-to-substrate gap. The base formulation uses 100 parts by weight of low-chloride bisphenol A epoxy resin, 80–90 phr methylhexahydrophthalic anhydride hardener, and 1–2 phr imidazole accelerator. Fused silica filler with a median particle size between 2 μm and 10 μm is loaded at 60–80 wt% of the total compound, with a silane coupling agent at 0.3–0.5 phr to reduce moisture uptake at the filler-matrix interface. The mixed encapsulant is degassed under vacuum at 1–10 mbar before dispensing to eliminate microvoids that later nucleate popcorning cracks during 260 °C reflow. Capillary underfill is dispensed with positive-displacement equipment through needle diameters between 0.15 mm and 0.25 mm, and the flow time must remain within the available gel window at 80–100 °C substrate temperature. Cure is carried out at 150 °C for 30–60 min, depending on module thermal mass. The filled system is qualified under IPC-4101E for base material limits, IPC-CC-830B for conformal coating properties, and UL 94 for V-0 classification. Dielectric strength is tested under ASTM D149-20, and volume resistivity is measured under IEC 60093. Moisture sensitivity is assessed according to JEDEC J-STD-020E; a weight gain above 0.1 wt% after 85 °C/85 % RH exposure is the practical limit before reflow popcorning is observed on production lots. Ionic purity is controlled with hydrolyzable chloride below 20 ppm and sodium below 5 ppm in the raw epoxy resin to avoid electrochemical migration on high-density modules. The table below summarizes the comparative effect of fused silica loading on key encapsulant properties.

    Typical industrial ranges for anhydride-cured epoxy encapsulants at varying fused silica loadings
    Filler loading (wt%)CTE α1 below Tg (ppm/K)Thermal conductivity (W/(m·K))UL 94 classification
    6032–380.6–0.7V-0
    7024–300.8–0.9V-0
    8018–221.0–1.2V-0

    When filler loading exceeds 80 wt%, mixed viscosity rises above 12 Pa·s at 25 °C under ISO 3219:2021, and capillary underfill flow stops before the fillet reaches the die edge. When filler loading falls below 60 wt%, the coefficient of thermal expansion rises above 35 ppm/K below glass transition, and solder bump shear fatigue is recorded on thermal cycling between −40 °C and 125 °C according to IPC-9701A. Terminal products include insulated-gate bipolar transistor power modules, automotive engine control units, LED driver modules, DC-DC converters, and printed circuit board underfill in high-density packages. The process boundary for this application is narrow: anhydride hardener systems must not be mixed with moisture-sensitive imidazole accelerators without dry storage, because prehydrolysis of the anhydride increases initial mixed viscosity and shortens the dispense window.

    When a 3–6 mm self-smoothing epoxy floor is placed over a concrete slab whose internal relative humidity exceeds 75 % RH, the controlling variable is not the resin stoichiometry but the osmotic pressure gradient at the interface. The binder is formulated from 100 parts of low-viscosity bisphenol A epoxy resin with 10–15 phr of C12–C14 glycidyl ether reactive diluent and a cycloaliphatic amine hardener matched to the adjusted epoxide equivalent weight. Quartz sand and graded silica fillers are mixed into the binder at 70–85 wt% of the total mortar to control shrinkage and early hardness. The primer layer is applied at 300–500 g/m², and a moisture-mitigation epoxy primer is mandatory when the slab internal relative humidity exceeds 75 % under ASTM F2170-19. Slab surface moisture emission is checked under ASTM F1869-22; emission above 3 lb/1000 ft²/24 h is a known failure threshold for osmotic blistering in solvent-free systems. The mixed mortar is poured onto the primed slab and spread with a notched trowel or rake, then back-rolled with a pin roller to release entrained air. Recoat between layers is performed within 12–24 h at 20 °C to maintain interlayer adhesion, and final service loading is delayed for 7 days to permit conversion of the aliphatic amine cure. Compliance under EN 13813:2002 classifies the system by compressive strength, adhesion, and impact resistance. Reaction-to-fire classification is evaluated under EN 13501-1:2018 where building codes require it. Adhesion to prepared concrete is tested under ASTM D7234-21, with typical values above 2 MPa and failure in the concrete substrate rather than at the interface. End products include pharmaceutical cleanroom floors, automotive showroom decks, logistics mezzanine surfaces, and chemical bund linings. When aggregate loading exceeds 85 wt%, mixed viscosity climbs above 100 Pa·s, trowel drag becomes excessive, and air entrapment increases. Below 70 wt%, thick-section exotherm can accelerate surface cure while the lower layer remains soft, producing roller marks and variable gloss.

    Autoclave-Cured Structural Adhesive Films and 177 °C Dicyandiamide Kinetics

    Autoclave-cured epoxy film adhesives for metal-to-metal bonding require strict control of dicyandiamide particle size distribution because dissolution and initiation kinetics compete with resin gelation between 140 °C and 177 °C. The base composition uses 100 parts of bisphenol A epoxy resin or tetraglycidyl methylenedianiline, 6 phr dicyandiamide latent hardener, 3 phr uron accelerator, and 10–15 phr carboxyl-terminated butadiene nitrile rubber for peel strength. Film adhesives are calendered to 0.2–0.4 mm thickness with areal weights between 300 g/m² and 500 g/m². Production bonding uses an autoclave cycle of 177 °C ± 5 °C for 60 min under 0.7 MPa positive pressure, with a ramp rate of 2 °C/min and vacuum bag pressure of −0.8 bar during the first ramp segment. The adhesive is qualified for lap shear strength under ASTM D1002-10 on chromic-acid-anodized aluminium, with values commonly specified above 25 MPa at 23 °C. Climbing drum peel is measured under ASTM D1781-98(2012), and impact peel resistance is evaluated under ISO 11343:2019. Material specification controls include out-time, storage at −18 °C, and cure-cycle tolerance because dicyandiamide systems are sensitive to undercure below 170 °C, which leaves unreacted accelerator domains and reduces wet glass transition below the design minimum. Overbaking above 185 °C induces oxidative degradation of the nitrile rubber phase and embrittlement at the bondline edge. Process equipment includes film adhesive slitting and lamination lines, solvent-wiped aluminium or titanium surface preparation, and autoclave bonding fixtures. Terminal products are bonded aluminium wing ribs, helicopter rotor blade trailing edges, nacelle acoustic panels, and fuselage panel stiffeners. This application is incompatible with moisture-containing surface preparations; adhesive film exposure to relative humidity above 55 % before cure can shift the glass transition temperature and reduce lap shear strength below the qualified minimum.

    When Cathodic Epoxy Electrocoat Baths Are Operated Below 150 V for Thin-Film Deposition

    When a cathodic epoxy electrocoat bath is operated below 150 V, edge coverage on sharp stamping burrs follows an exponential current-density relationship that is not captured by standard rectifier set-point data alone. The electrocoat feedstock is an epoxy-amine adduct made from 100 parts bisphenol A epoxy resin reacted with a secondary amine to form a cationic binder, then crosslinked with a blocked isocyanate at 25–35 phr. The bath is operated at 15–20 wt% solids, a pH of 5.5–6.5, conductivity of 1200–1800 µS/cm, and bath temperature of 30–35 °C. Deposition voltage is maintained between 150 V and 250 V DC, with deposition time of 2–3 min for automotive body shells. After deposition, the surface is rinsed with ultrafiltrate to remove drag-out and baked at 170–180 °C for 20–30 min. Exterior dry film thickness is controlled at 18–25 μm, while interior box sections are specified at 10–15 μm because current density decays with distance from the counter electrode. Corrosion resistance is tested under ISO 9227:2017 neutral salt spray and ASTM B117-19, while cross-cut adhesion is measured under ISO 2409:2020 or ASTM D3359-17. Automotive production lines are controlled under IATF 16949:2016 for bath consistency and traceability. The phosphate pretreatment layer must have a coating weight of 2–3.5 g/m² for zinc phosphate, and oil contamination above 1 g/m² on the steel surface produces cratering and uneven edge deposition. Terminal products include body-in-white automotive primers, suspension coil springs, chassis frames, and agricultural equipment subframes. The operational boundary is sharp: when the rectifier is set below 150 V, thin-film deposition on inside edges becomes insufficient for salt spray requirements, while operation above 250 V can exceed the rupture voltage of the freshly deposited film and generate pinhole defects that trap phosphate residues.

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    Certification & Compliance
    More Introduction
    In standard liquid form, epoxy resin is supplied as a bisphenol A diglycidyl ether with an epoxide equivalent weight of 184–190 g/eq and a dynamic viscosity of 11,000–14,000 mPa·s at 25 °C when measured by ISO 3219. Commercial equivalents include Olin DER 331, Hexion EPON 828, Kukdo YD-128, and Nan Ya NPEL-128. The neat resin contains no solvent or reactive diluent, has a density of 1.16 g/cm³ at 25 °C, and is supplied in low-chlorine grades with total hydrolyzable chlorine controlled to < 300 ppm per ASTM D1726. Heating to 40 °C reduces viscosity to approximately 1,500–2,500 mPa·s, a range compatible with piston meter-mix dispensing through static mixers of 12–24 elements.
    Typical Liquid DGEBA Resin Specifications
    PropertyTest methodTypical value
    Epoxide equivalent weightASTM D1652-11184–190 g/eq
    Viscosity at 25 °CISO 321911,000–14,000 mPa·s
    Density at 25 °CASTM D40521.16 g/cm³
    Total hydrolyzable chlorineASTM D1726< 300 ppm
    Flash pointASTM D93> 200 °C

    What Limits the Amine-Cure Working Window?

    The practical upper limit for amine-cure pot life is set by exotherm generation rather than gelation alone. In a 100 g mass of DGEBA mixed with triethylenetetramine at a stoichiometric ratio of 0.9:1.0, gel time at 25 °C is typically 30–40 min per ISO 2535; increasing the batch mass to 500 g can raise the center temperature above 130 °C and reduce gel time below 15 min. The processing window remains within ±5 °C of the mixing temperature. Colder material raises viscosity and produces incomplete wetting, while warmer material accelerates amine reaction and can trap bubbles in the cured matrix. In high-humidity environments above 60 % RH, aliphatic amine hardeners undergo carbamation at the resin–air interface. The resulting surface bloom reduces intercoat adhesion and must be removed mechanically before subsequent application. Stoichiometric control is critical because amine hardener has an active hydrogen equivalent weight of 24–27 g/eq. Adding excess epoxy above 10 % of stoichiometry increases chemical resistance but lowers heat deflection temperature, while excess amine above 10 % improves flexibility but can increase moisture absorption. Vacuum degassing at 1–5 kPa absolute pressure for 5–10 min after mixing removes entrained air from filled compounds. On production lines, continuous mix equipment should maintain resin temperature at 25–30 °C and hardener temperature at 20–25 °C to limit viscosity drift during a shift. Surface preparation, rather than resin chemistry, often controls adhesion to steel and concrete substrates. On steel, a near-white blast per SSPC-SP 10 with a 75–100 µm angular profile is required before coating. Pull-off adhesion of a filled DGEBA/amine primer after 7 days cure at 23 °C typically exceeds 25 MPa when tested per ASTM D4541. On concrete, moisture content should be below 4 % by calcium carbide or equivalent, and tensile pull-off values above 2.5 MPa generally produce substrate failure rather than adhesive failure. Avoid urethane-based primers beneath amine-cured epoxy because residual isocyanate reactivity can form an interphase layer with reduced intercoat adhesion.

    When Epoxy Replaces Vinyl Ester in Secondary Containment

    Epoxy resin is selected over vinyl ester for secondary containment when dry adhesion to concrete and resistance to alkaline scrubbers are more critical than oxidative acid tolerance. Chemical resistance of DGEBA/amine systems is commonly ranked by immersion testing under ASTM D543-21. Typical mass change in 25 % sodium hydroxide falls below 1 % after 28 days at 23 °C, while 10 % acetic acid can produce mass change above 5 % depending on hardener selection. The trade-off is chemical: the cured epoxy network contains a high concentration of hydroxyl groups, which improve wetting and concrete bond, but the same sites are susceptible to hydrolysis in concentrated organic acids. Vinyl ester systems generally show better resistance to 20 % nitric acid but lower pull-off adhesion to damp concrete. For containment linings, a filled DGEBA/cycloaliphatic amine system with 2–3 wt% fumed silica is applied at 1,500–2,500 µm wet film thickness in two coats. The first coat is forced into the concrete profile with a squeegee, followed by a back-roller to release air. Recoat interval is typically 12–24 h at 20 °C; exceeding 48 h can require mechanical abrasion to restore intercoat adhesion. Lining designers must also specify continuous immersion temperature limits. Standard DGEBA/amine linings are generally rated for continuous service up to 60–80 °C in aqueous alkali, but published data for this specific configuration is limited above 80 °C. High-shear dispersion of solvent-free epoxy flooring compounds begins with high-viscosity base resin and reactive diluent adjustment. A vacuum dissolver operating at 1,000–1,500 rpm with a toothed disc diameter 0.3–0.5 times vessel diameter disperses fumed silica at 2–4 wt%. Dispersion time of 10–15 min at 40 °C typically produces a Hegman grind below 40 µm. Overdispersion above 1,500 rpm can raise compound temperature above 50 °C, shortening pot life to less than 20 min and creating air entrainment. In production, material is applied within 30 min of mixing using a notched squeegee and spike roller. Batch-to-batch viscosity variance should be held below ±10 % of the nominal 5,000–8,000 mPa·s at 25 °C after silica addition.

    Mechanical Property Differences Across Polyester, Urethane, and Epoxy Matrices

    When cured with a cycloaliphatic amine at 23 °C for 7 days, a neat DGEBA casting exhibits tensile strength of 55–68 MPa per ISO 527-2, flexural modulus of 2.8–3.2 GPa per ISO 178, and heat deflection temperature of 80–110 °C per ISO 75-2. Volumetric shrinkage during cure is 1–3 %, significantly lower than that of orthophthalic polyester at 6–10 %. This difference reduces internal stress in thick castings and improves dimensional stability in tooling blocks. Polyester systems cure by free-radical polymerization with styrene, yielding lower moisture resistance and lower adhesion to mineral substrates. Polyurethane systems provide elongation of 200–600 % but heat deflection temperature is typically below 80 °C.
    Comparative Cured Resin Properties
    PropertyMethodDGEBA/amineOrthophthalic polyesterVinyl esterPolyurethane
    Tensile strengthISO 527-255–68 MPa50–70 MPa70–85 MPa25–50 MPa
    Elongation at breakISO 527-23–6 %1.5–3 %4–7 %200–600 %
    Flexural modulusISO 1782.8–3.2 GPa3.0–3.8 GPa2.9–3.4 GPa0.01–0.10 GPa
    Heat deflection temperatureISO 75-280–110 °C55–70 °C90–105 °C< 80 °C
    Volumetric shrinkageASTM D25661–3 %6–10 %5–8 %0.5–2 %
    The comparison shows that epoxy occupies a middle position between high-stiffness polyester and high-elongation polyurethane. Unlike polyester, epoxy does not require wax sealing or styrene suppression additives for open-face curing. Unlike polyurethane, amine-cured epoxy is not moisture-sensitive during cure, although condensation at high humidity can produce surface defects. These differences determine selection in composite tooling, industrial flooring, and electrical potting. Novolac epoxy grades are specified when heat deflection temperature must remain above 150 °C under continuous load. A typical epoxidized phenol novolac resin with an epoxide equivalent weight of 170–180 g/eq and viscosity of 1,100–1,500 mPa·s at 52 °C is cured with 4,4'-diaminodiphenyl sulfone at a stoichiometric ratio of 1.0. The cure cycle of 2 h at 120 °C followed by 4 h at 180 °C produces a glass transition temperature above 200 °C. The hardener is a solid with a melting point near 175 °C, so the system requires heated metering equipment. In a semiconductor encapsulation compound, a transfer press with barrel temperature 70–80 °C, mold temperature 165–175 °C, and clamping force above 50 t is typical. The cure window is narrow because mold temperature must be held within ±5 °C of the formulated gel plateau to avoid incomplete fill and knit-line cracking.